Машина для нанесения PVD-покрытий для электроники, производитель вакуумных машин для магнетронного распыления

Features of PVD Coating Machine for Electronics:

High-stability magnetron sputtering source: Optimized magnetic field distribution and target structure create a stable, high-density plasma, enabling low-damage, controllable-rate thin film deposition to meet the film consistency requirements of electronic devices.

High-cleanliness vacuum chamber structure: The internal structure of the chamber is optimized for the cleanliness of electronic coatings, effectively reducing particulate contamination and impurity introduction, improving film purity and reliability.

Precision sputtering power control: Independent power supply and power regulation system support both low-power fine deposition and high-power efficiency deposition, adapting to different electronic functional film process windows.

Consistent coating effect: Through coordinated control of target-substrate distance, rotation system, and deposition parameters, uniform film thickness and highly repeatable sputtering effects are achieved on the surface of electronic components.

Cryogenic sputtering process adaptation: Magnetron sputtering has a minimal heat-affected zone, suitable for temperature-sensitive electronic substrates and precision components, reducing the risk of thermal stress.

Integrated automated control system: Supports the storage and retrieval of process parameters, ensuring highly consistent coating performance in mass production.

Multi-electronic application compatibility: Adapts to the coating requirements of different electronic application scenarios, including functional enhancement, surface protection and performance improvement, providing a universal sputtering coating platform for the electronics industry.