Optical Vacuum Coating Machine for Electronic Components, PVD Coating Machine Manufacturer

Features of the Optical Vacuum Coating Machine for Electronic Components:

Clean and gentle evaporation deposition process: Employing electron beam evaporation technology, which significantly reduces high-energy ion bombardment compared to sputtering processes, it is more suitable for electronic components sensitive to electrical and optical performance. The vacuum evaporation path is pure, with direct vaporization and deposition of raw materials, effectively reducing the risk of target backsplashing and cross-contamination, contributing to the acquisition of high-purity, low-defect optical thin films.

Nanoscale film thickness control and ultra-low optical loss: Integrating a high-precision optical monitoring and crystal oscillator monitoring system, sub-nanometer film thickness resolution is achieved, ensuring that the spectral performance of complex multilayer film systems closely approximates theoretical design values. The deposited dielectric films (such as SiO₂, Ta₂O₅, Al₂O₃) exhibit extremely low absorption and scattering losses, significantly improving the quantum efficiency and signal-to-noise ratio of optoelectronic devices.

Multifunctional material platform: Capable of evaporating high-purity metals, alloys, and key dielectric materials, providing a one-stop solution for various coating needs, including electrodes, passivation layers, high-reflectivity/anti-reflection coatings, and waveguide layers.

High deposition rate and throughput: Electron beam evaporation has a fast rate, especially for dielectric materials such as oxides, significantly improving production efficiency and meeting the needs of medium- to high-volume manufacturing.

Excellent process repeatability: The mature evaporation process is highly stable, with easily controllable parameters. Combined with fully automated process formulations, it ensures excellent batch-to-batch repeatability, providing a reliable guarantee for large-scale production.

Outstanding substrate compatibility: Specifically designed to adapt to various electronic component carriers, including 2- to 8-inch wafers, ceramic packages, and irregularly shaped optical windows, providing customized fixture solutions.